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Hitoshi Morinaga: Relationship between visualization of the polishing interface and
removal rate in resin CMP, Proceedings of International Conference on Planarization/CMP
Technology 2023, (2023) P047-001-004. (in Kanazawa, Japan)
061)Tatsuyuki Wada, Michio Uneda, Tadakazu Miyashita, Yuko Yamamoto, and Ken-ichi Ishikawa:
Development of new polishing concept using magnet, Proceedings of International Conference
on Planarization/CMP Technology 2023, (2023) P34-001-003. (in Kanazawa, Japan)
060)Kotaro Saito, Michio Uneda, Kyousuke Tenkou, Kazutoshi Hotta, and Hitoshi Morinaga:
The impact of consumable properties on 3-D polishing through visualization of the polishing
process, Proceedings of International Conference on Planarization/CMP Technology 2023,
(2023) P050-001-003. (in Kanazawa, Japan)
059)Hironori Murakami, Kyoka Kokubu, Michio Uneda, and Ken-ichi Ishikawa: Development of a virtual
reality appreciation system for Japanese swords,
Proceedings of ATEM-iDICs '23, JSME-MMD & iDICs, (2023) A10. (in Awara, Japan)
058)Michio Uneda, Mizuki Hatatani, Naoki Kubo, Kazutoshi Hotta and Hitoshi Morinaga: Visualization
of slurry particle behavior using evanescent field during chemical mechanical polishing,
Proceedings of International Conference on Planarization/CMP Technology 2022,
(2022). (in Portland, USA)
057)Shunpei OTA, Michio UNEDA, Yuko YAMAMOTO, Tadakazu MIYASHITA and Ken-ichi ISHIKAWA:
In-Situ Prediction of Removal Rate utilizing Neural Networks in Chemical Mechanical Polishing of
Sapphireg, Proceedings of Asian Workshop on Planarization/ CMP Technology 2021, (2021)
11-13.
056)Takaho MIYATA, Michio UNEDA, Kyosuke TENKOU, Kazutoshi HOTTA and Hitoshi MORINAGA:
Visualization of tool behavior in three dimensional polishing: Relationship between removal
amount distribution and tool behavior, Proceedings of The 23rd International Symposium on
Advances in Abrasive Technology, (2021) 301-305.
055)Koji Fujii and Michio Uneda: Development of High Efficiency Polishing Method of SiC Substrate
assisted by Nanobubbles Containing Ozone Gas, Proceedings of International Conference on
Planarization/CMP Technology 2019, (2019) 171-172. (in Hsinchu, Taiwan)
054)Daichi Yoshisaki, Michio Uneda, Kazutaka Shibuya and Ken-ichi Ishikawa: Development of Intelligent
Polishing System by Artificial Intelligence using Neural Network and Its Application, Proceedings of
International Conference on Planarization/CMP Technology 2019, (2019) 149-150.
(in Hsinchu, Taiwan)
053)Nodoka Yamada, Yoshihiro Tawara and Michio Uneda: Relationships among removal rate, friction
coefficient and pad surface roughness in CMP of glass substrate using suede type polishing pad,
Proceedings of International Conference on Planarization/CMP Technology 2019, (2019)
151-152. (in Hsinchu, Taiwan)
052)Yutaro Arai, Takashi Fujita and Michio Uneda: Novel Pad Conditioning Technology by Ceramics Flexible
Fiber Conditioner, Proceedings of International Conference on Planarization/CMP Technology 2019,
(2019) 118-119. (in Hsinchu, Taiwan)
051)Masanori Fujimoto and Michio Uneda: Evaluation of dynamical behavior of slurry particle under
electric field, Proceedings of International Conference on Planarization/CMP Technology 2018, (2018)
318-321. (in Seoul, Korea)
050)Ryoishi Shiyama, Michio Uneda, Kazutoshi Hotta, Kazusei Tamai, Hitoshi Morinaga and Ken-ichi
Ishikawa: Dynamic behavior analysis of magnetic clusters for three dimensional magnetic assisted
polishing, Proceedings of International Conference on Planarization/CMP Technology 2018, (2018)
314-317. (in Seoul, Korea)
049)Koji Fujii, Michio Uneda, Kazutaka Shibuya, Yoshio Nakamura, Daizo Ichikawa and Kenichi Ishikawa:
High Efficient CMP Method of SiC by Enhanced Slurry Containing Nano-bubbles with Active Gas,
Proceedings of International Conference on Planarization/CMP Technology 2018, (2018) 310-313.
(in Seoul, Korea)
048)Kyo Oi, Michio Uneda and Ken-ichi Ishikawa: Visualization of hand-polishing process for Japanese
swords - Mechanical properties of natural and artificial polishing stones and Kansei evaluation
by craftsmen -, Proceedings of 12th International Symposium on Advanced Science and Technology
in Experimental Mechanics, 104 (2017) 1-4. (in Kanazawa, Japan)
047)Shinya MIZUUCHI, Michio UNEDA, Kazutaka SHIBUYA, Yoshio NAKAMURA, Daizo ICHIKAWA and
Ken-ichi Ishikawa: Chemical Mechanical Polishing of SiC Substrate Using Enhanced Slurry Containing
Nanobubbles with Active Gas Generated by Plasma, Proceedings of International Conference on
Planarization/CMP Technology 2017, (2017) 401-405. (in Leuven, Belgium)
046)Masanori FUJIMOTO and Michio UNEDA: Proposal of Spraying Pure Water Method under the Electric
Field and Its Bahavior Observation in the Cleaning Process of CMP, Proceedings of International
Conference on Planarization/CMP Technology 2017, (2017) 372-376. (in Leuven, Belgium)
045)Yuichi Tomiie, Michio Uneda, Kazutoshi Hotta, Kazusei Tamai, Hitoshi Morinaga and Ken-ichi Ishikawa:
Effect of pad surface temperature and dry/ wet conditions on pad surface properties, Proceedings of
International Conference on Planarization/CMP Technology 2015, (2015) 69-72. (in Arizona, USA)
Scopus
Web of Science
044)Takahiro Matsunaga, Michio Uneda, Yoshihiro Takahashi, Kazutaka Shibuya, Yoshio Nakamura,
Daizo Ichikawa and Ken-ichi Ishikawa: Influence into Platen and Polishing Pad Surface Temperature on
Removal Rate in Sapphire- Chemical Mechanical Polishing, Proceedings of International Conference on
Planarization/CMP Technology 2015, (2015) 267-270. (in Arizona, USA)
Scopus
Web of Science
043)Michio Uneda, Keiichi Takano, Koji Koyama, Hideo Aida and Ken-ichi Ishikawa: Influence of Linear
Velocity Ratio on Removal Rate of Sapphire- Chemical Mechanical Polishing, Proceedings of 2015
JSME-IIP/ ASME-ISPS Joint Conference on Micromechatronics for Information and Precision
Equipment (MIPE 2015), (2015) WeC-2-2. (in Kobe, Japan)
042)Yutaro Arai, Takashi Fujita, Naoki Takahashi and Michio Uneda: Long Life Mechanism on a Flexible
Fiber Conditioner in CMP, Proceedings of International Conference on Planarization/CMP Technology
2014, (2014) 162-167. (in Kobe, Japan)
Scopus
Web of Science
041)Michio Uneda, Yuya Fukuta, Yasuaki Itou, Kazutoshi Hotta, Kazusei Tamai, Hitoshi Morinaga and
Ken-ichi Ishikawa: Influence of Slurry Flow Behavior on Material Removal Rate of Sapphire-Chemical
Mechanical Polishing, Proceedings of the 15th International Conference on Precision Engineering,
(2014) 281-282. (in Kanazawa, Japan)
040)Michio Uneda, Yuya Fukuta, Yasuaki Itou, Kazutoshi Hotta, Kazusei Tamai, Hitoshi Morinaga and
Ken-ichi Ishikawa: Relationships Between Polishing Variables, Removal Rate and Slurry Flow in
Sapphire-CMP, Proceedings of International Conference on Planarization/CMP Technology 2013,
(2013) 277-280. (in Hsinchu, Taiwan)
039)Michio Uneda, Kiyomi Fujii and Ken-ichi Ishikawa: Processing Characteristics of Fixed Abrasive
Mechanical Polishing Using Double-Sided Four-Way Machine, Proceedings of International Conference
on Planarization/CMP Technology 2013, (2013) 264-267. (in Hsinchu, Taiwan)
038)Michio Uneda, Yoshihiro Takahashi, Kazutaka Shibuya, Yoshio Nakamura, Daizo Ichikawa and
Ken-ichi Ishikawa: Relationships Between Removal Rate, Pad Surface Asperity and Polishing Head
Vibration in Si-CMP, Proceedings of International Conference on Planarization/CMP Technology 2013,
(2013) 214-217. (in Hsinchu, Taiwan)
037)Michio Uneda, Tatsunori Omote, Kazutaka Shibuya, Yoshio Nakamura, Daizo Ichikawa and Ken-ichi
Ishikawa: Evaluation for In-Plane Micro Deformation Distribution Characteristics of Polishing Pad
Surface Texture, Proceedings of Advanced Metallization Conference 2012 21st Asian Session
(ADMETA PLUS 2012), (2012) 94-95. (in Tokyo, Japan)
036)Shinichi Iwamoto, Syuhei Kurokawa, Toshiro Doi, Michio Uneda, Osamu Ohnishi, Toshiyuki Suzuki,
Yasuhiro Kawase and Ken Harada: Evaluation of surface damaged layer depth of Si wafer for TSV,
Proceedings of Advanced Metallization Conference 2012 21st Asian Session (ADMETA PLUS 2012),
(2012) 88-89. (in Tokyo, Japan)
035)Takateru Egashira, Toshiro Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Isamu Koshiyama
and Daizo Ichikawa: Characteristics of Sapphire CMP Under Various Gas Conditions Using Bell-Jar
Type CMP Machine, Proceedings of Advanced Metallization Conference 2012 21st Asian Session
(ADMETA PLUS 2012), (2012) 90-91. (in Tokyo, Japan)
034)Michio UNEDA, Yuya FUKUTA, Kazutoshi HOTTA, Hiroyasu SUGIYAMA, Hitoshi MORINAGA and
Ken-ichi ISHIKAWA: A Novel Evaluation Method of Polishing Slurry Flow Using Digital Image
Processing - Mechanical Polishing for Sapphire using Diamond Slurry -, Proceedings of International
Conference on Planarization/CMP Technology 2012, (2012) 321-325. (in Grenoble, France)
033)Yu Moriwaki, Tsutomu Yamazaki, Toshiro K. Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda
and Kiyoshi Seshimo: Development of Novel Pad Groove Designs to Achieve High Efficiency CMP
- 2nd Report: Friction Characteristic for Glass Polishing -, Proceedings of International Conference on
Planarization/CMP Technology 2011, (2011) 494-497. (in Seoul, Korea)
032)Tsutomu Yamazaki, Toshiro K. Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Yoji Umezaki,
Kiyoshi Seshimo and Hideo Aida: Development of Novel Pad Groove Designs to Achieve High Efficiency
CMP - 1st Report: Designing of Novel Groove Patterns Based on Image Analysis of Slurry Flow
Behavior -, Proceedings of International Conference on Planarization/CMP Technology 2011,
(2011) 490-493. (in Seoul, Korea)
031)Hiroshi Ikeda, Yoichi Akagami, Michio Uneda, Osamu Ohnishi, Syuhei Kurokawa and Toshiro K. Doi:
The High-Efficiency Polishing Technology for Glass Substrates using Electrical Controlled Slurry
Polishing, Proceedings of International Conference on Planarization/CMP Technology 2011, (2011)
428-431. (in Seoul, Korea)
030)Hideo Aida, Hidetoshi Takeda, Seong-Woo Kim, Koji Koyama, Natsuko Aota, Tsutomu Yamazaki,
Michio Uneda and Toshiro Doi: Bowing Control of Double-Side-Polished c-plane GaN Substrate,
Proceedings of International Conference on Planarization/CMP Technology 2011, (2011) 416-419.
(in Seoul, Korea)
029)Shinji Koga, Toshiro Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Yoji Matsukawa,
Keiji Matsuhiro and Tsutomu Yamazaki: Removal Mechanism of Oxide Single Crystal in Chemical
Mechanical Polishing, Proceedings of International Conference on Planarization/CMP Technology 2011,
(2011) 395-398. (in Seoul, Korea)
028)Michio UNEDA, Yuki MAEDA, Tatsunori OMOTE, Kazutaka SHIBUYA, Yoshio NAKAMURA,
Koichiro ICHIKAWA, Ken-ichi ISHIKAWA, Toshiro DOI and Hideo AIDA: Relationship among Pad
Conditioning Method, Cutting rate and Pad Surface Micro-Texture in CMP, Proceedings of ICPT2011,
(2011) 236-239. (in Seoul, Korea)
027)Michio UNEDA, Tatsunori OMOTE, Yuki MAEDA, Kazutaka SHIBUYA, Yoshio NAKAMURA,
Koichiro ICHIKAWA, Ken-ichi ISHIKAWA, Toshiro DOI and Hideo AIDA: Micro-Deformation Distribution
Characteristics of CMP Pad at Conditioning Process in CMP - Relationship between Results of Micro-
Deformation and Contact Image Analysis -, Proceedings of International Conference on
Planarization/CMP Technology 2011, (2011) 232-235. (in Seoul, Korea)
026)Tao Yin, Toshiro Doi, Syuhei Kurokawa, Osamu Ohnishi, Tsutomu Yamazaki, Michio Uneda,
Zhida Wang, Zhe Tan and Takateru Egashira: Processing Characteristics of SiC Wafer by Atmosphere-
Controlled CMP Machine, Proceedings of International Conference on Planarization/CMP Technology
2011, (2011) 165-168. (in Seoul, Korea)
025)Satoshi Yamaguchi, Toshiro Doi, Hiroyuki Kohno, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda
and Yoji Matsukawa: Simplified method of evaluating scratches on the wafer polished by fumed silica
slurry, Proceedings of International Conference on Planarization/CMP Technology 2011, (2011)
62-65. (in Seoul, Korea)
024)Osamu Ohnishi, Toshiro Doi, Syuhei Kurokawa, Tsutomu Yamazaki, Michio Uneda, Kei Kitamura,
Tao Yin, Isamu Koshiyama and Koichiro Ichikawa: CMP Characteristics of SiC Wafers Using a
Simultaneous Double-side CMP Machine -Effects of Atmosphere and Ultraviolet Light Irradiation-,
Proceedings of Advanced Metallization Conference 2011 21st Asian Session (ADMETA PLUS 2011),
(2011) 110-111. (in Tokyo, Japan)
023)Tsutomu Yamazaki, Toshiro K. Doi, Syuhei Kurokawa, Michio Uneda, Osamu Ohnishi,Kiyoshi Seshimo
and Yasunori Aso: Development of New Groove Patterns on CMP Pad -Slurry Flow Analysis using
Digital Image Processing-, Proceedings of Advanced Metallization Conference 2011 21st Asian Session
(ADMETA PLUS 2011), (2011) 112-113. (in Tokyo, Japan)
022)Michio Uneda, Tatsunori Omote, Ken-ichi Ishikawa, Toshiro Doi, Syuhei Kurokawa and Osamu Ohnishi:
Performance Evaluation Method of CMP Pad Conditioner Using Digital Image Correlation (DIC)
Processing, Proceedings of Advanced Metallization Conference 2011 21st Asian Session (ADMETA
PLUS 2011), (2011) 114-115. (in Tokyo, Japan)
021)Michio UNEDA, Kenji OKABE, Norihiko MORIYA, Kazutaka SHIBUYA and Ken-ichi ISHIKAWA:
Development of Evaluation Method for Geometric Characterization of Polishing Pad Surface Texture
Based on Contact Image Analysis Using Image Rotation Prism - Relationship between Proposed
Evaluation Parameters and Polishing Characteristics -, Proceedings of International Conference on
Planarization/CMP Technology 2010, (2010) 360-363. (in Arizona, USA)
020)Michio UNEDA, Mikio TOSHIMA and Ken-ichi ISHIKAWA: Study on Accuracy Evaluation of Three-
Dimensional Visualization Measurement using Near Field Stereo System Based on Digital Image
Correlation Methodology, Proceedings of 5th International Symposium on Advanced Science and
Technology in Experimental Mechanics, (2010) CD-ROM. (in Kyoto, Japan).
019)Michio UNEDA, Hiroaki KONDO, Yusuke MURAOKA and Ken-ichi ISHIKAWA: Experimental Study on
Locations Estimation of High Correlation Sound Sources using Combined SSP and MUSIC Method,
Proceedings of 5th International Symposium on Advanced Science and Technology in Experimental
Mechanics, (2010) CD-ROM. (in Kyoto, Japan).
018)Michio UNEDA, Shintaro MURATA and Ken-ichi ISHIKAWA: Study on Quantitative Evaluation of Slurry
Flow Mechanism at Lapping Processing using Digital Image Correlation Method - Correlation of Slurry
Flow and Lapping Characteristics in Oscillation Controlled Lapping -, Proceedings of 5th International
Symposium on Advanced Science and Technology in Experimental Mechanics, (2010) CD-ROM.
(in Kyoto, Japan).
017)Michio UNEDA, Kenji OKABE, Norihiko MORIYA, Takumi KOBAYASHI, Kazutaka SHIBUYA and Ken-ichi
ISHIKAWA: Development of Evaluation Method of Pad Surface Characteristics Based on Contact Image
Analysis Using Image Rotation Prism, Proceedings of International Conference on Planarization/CMP
Technology 2009 (2009) 483-488. (in Fukuoka, Japan)
016)Yoshinori TAKEI, Hiroyuki KAWAI, Michio UNEDA, Hideto NANTO, and S KOYAMA: Odor source
localization for early fire detection by using MOS-type gas sensor array with infrared vision,
Proceedings of PRiME 2008, (2008). (in Hawaii, USA)
Scopus
015)Michio UNEDA, Setsuo IWATA, Koichiro TOMA, Masakatsu MATSUISHI, and Ken-ichi ISHIKAWA:
Effect of Out-of-Plane Deformation on Strain Measurement using the Digital Image Correlation
Method, Proceedings of ATEM'07, The Materials and Mechanics Division of the Japan society of
Mechanical Engineers, (2007) OS9-1-2. (in Fukuoka, Japan)
014)Michio UNEDA, and Nobuaki FUJIKI: Consideration of Course Improvement Activities and Its Effect on
Mechanical Designing and Drawing Project, Proceedings of FEDSM07, (2007) 1-5. (in San Diego, USA)
Scopus
Web of Science
013)Michio UNEDA, Hiromasa TSUKADA, Ken-ichi ISHIKAWA, and Hitoshi SUWABE: Studies on Slicing
Characteristics of Vibratory OD-blade Slicing, Proceedings of ASPE 2006 Annual Meetings, American
Society for Precision Engineering, (2006) CD-ROM. (in Monterey, California, USA)
Scopus
012)Michio UNEDA, Ken-ichi ISHIKAWA, Hitoshi SUWABE, and Hiromasa TSUKADA: Studies on Oscillation
Controlled Lapping using Small Diameter Lap Tool, Proceedings of ASPE 2006 Annual Meetings,
American Society for Precision Engineering, (2006) CD-ROM. (in Monterey, California, USA)
Scopus
011)Michio UNEDA, Ken-ichi ISHIKAWA, Hioshi SUWABE, and Hiromasa TSUKADA: Development of
Vibratory OD-blade Slicing using Mechanical Elliptical Vibration Spindle -Vibration Slicing Principle
and Basic Slicing Characteristics-, Proceedings of International Conference on Leading Edge
Manufacturing in 21st Century, (2005) 625-629. (in Nagoya, Japan)
Scopus
010)Michio UNEDA, and Ken-ichi ISHIKAWA: A Study on Basic Performance Comparison with Acoustic
Holography and MUSIC Methods in Sound Source Identification, Proceedings of The First International
Symposium on Advanced Technology of Vibration and Sound, (2005) 64-68. (in Miyajima, Japan)
009)Michio UNEDA, Hitoshi SUWABE, and Ken-ichi ISHIKAWA: Grinding Simulation with Diamond Pellets
and Optimization of Its Grinding Conditions, Proceedings of ASPE 2004 Annual Meetings, American
Society for Precision Engineering, (2004) CD-ROM. (in Orland, Florida, USA)
008)Michio UNEDA, and Ken-ichi ISHIKAWA: Location Finding Characteristics of Spread Sound Sources
by means of MUSIC Algorithm, Proceedings of ICA 2004, International Congress on Acoustics, (2004)
751-754. (in Kyoto, Japan)
007)Michio UNEDA, and Ken-ichi ISHIKAWA: A Proposal of the MUSIC Algorithm for Short Range Signal
Sources and the Application for the Location Finding, Proceedings of ATEM'03, The Materials and
Mechanics Division of the Japan society of Mechanical Engineers, (2003) CD-ROM (GSW0132).
(in Nagoya, Japan)
006)Michio UNEDA, Hirokazu HOKAZONO: DOA Estimation Characteristics of the MUSIC Algorithm for
the Actual Extended Targets of the Chirp Pulse Tracking Radar, Proceedings of IEEE Radar
Conference 2002, IEEE, (2002) CD-ROM. (in Long Beach, California, USA)
Scopus
Web of Science
005)Ken-ichi ISHIKAWA, Hitoshi SUWABE, and Michio UNEDA: Study on Vibration OD-Blade Slicing with
Air-Mist Working fluid for Environment -Effect of Applied Vibration Amplitude on Slicing
Characteristics-, Proceedings of ASPE 1999 Annual Meetings, American Society for Precision
Engineering, (1999) 489-492. (in Monterey, California, USA)
Web of Science
004)Ken-ichi ISHIKAWA, Hitoshi SUWABE, and Michio UNEDA: Vibration Cutting Method of OD-Blade With
Atomized Working Fluid, Proceedings of ASPE 1998 Annual Meetings, American Society for Precision
Engineering, (1998) 80-83. (in St. Louis, Missouri, USA)
Web of Science
003)Ken-ichi ISHIKAWA, Hitoshi SUWABE, and Michio UNEDA: Vibration Effect on Cutting Characteristics
Using OD-Blade -Theoretical Consideration of Cutting Mechanism-, Proceedings of 9th International
Precision Engineering Seminar and 4th International Conference on Ultraprecision in Manufacturing
Engineering, 2 (1997) 554-557. (in Braunschweig, Germany)
002)Hitoshi SUWABE, Ken-ichi ISHIKAWA, and Michio UNEDA: Effect of Vibration using Ultrasonic and
Low Frequency Vibrations on Grooving Process for Hard and Brittle Materials, Proceedings of ASPE
1996 Annual Meetings, American Society for Precision Engineering, (1996) 542-545.
(in Monterey, California, USA)
001)Ken-ichi ISHIKAWA, Hitoshi SUWABE, and Michio UNEDA: Development of Vibration Cutting using
OD-Blade, Proceedings of ASPE 1996 Annual Meetings, American Society for Precision Engineering,
(1996) 572-577. (in Monterey, California, USA)
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